Strategic technology partnerships



Methods2Business joint Wi-Fi Alliance in May 2017.
Methods2Business sees this membership as the way to make sure that its licensable Wi-Fi HaLow IP products will be interoperable with other Wi-Fi HaLow™ devices on the market. Therefore the company actively supports the Wi-Fi HaLow™ program of Wi-Fi Alliance.

Wi-Fi Alliance® is the worldwide network of companies that brings you Wi-Fi®. Members of their collaboration forum come together from across the Wi-Fi ecosystem with the shared vision to connect everyone and everything, everywhere, while providing the best possible user experience. Since 2000, Wi-Fi Alliance has certified more than 30,000 Wi-Fi products. The Wi-Fi CERTIFIED™ seal of approval designates products with proven interoperability, backward compatibility, and the highest industry-standard security protections in place.

Today, Wi-Fi carries more than half of the internet’s traffic in an ever-expanding variety of applications. Wi-Fi Alliance continues to drive the adoption and evolution of Wi-Fi, which billions of people rely on every day.


Methods2Busuess partners with Adapt-IP in Silicon Valley to build Wi-Fi HaLow System-on-Chips solutions integrating their digital baseband into Methods2Business MAC IP platform.

Adapt-IP is based in Silicon Valey and develops connectitity and security IP, including baseband IP for wireless, and USB 2.0 & 3.0 IP for wired connections.





Cadence is a leading provider of electronic design automation (EDA) and semiconductor intellectual property (IP). Cadence custom/analog tools help engineers design the transistors, standard cells, and IP blocks that make up systems on chip (SoCs). Cadence digital tools automate the design and verification of giga-scale, giga-hertz SoCs at the latest semiconductor processing nodes. Cadence IC packaging and PCB tools permit the design of complete boards and subsystems.

Cadence also offers a growing portfolio of design IP and verification IP for memories, interface protocols, analog/mixed-signal components, and specialized processors. And at the systems level, Cadence offers an integrated suite of hardware/ software co-development platforms. In short, Cadence’s innovative technologies are essential to building great products that transform lives.
Methods2Business has an Engineering Services Partner License Agreement with Cadence IP for developing ASICS with Cadence application-specific microprocessor solutions (Tensilica DSP technology)  for the purpose of supporting mutual customers.   


Methods2Business and IMEC-NL demonstrated in 2016 first Ultra-Low-Power Wi-Fi HaLow™ 802.11ah solution using Imec’s ULPWIFI radio and baseband and Methods2Business 802.11ah MAC IP. 

Today, they work on the best-in-class solution for ultra-low-power Wi-Fi HaLow chipsets integrating Methods2Business MAC and Baseband solutions with Imec's ULPWIFI radio.

Both parties target market introduction in 2019 and show industry leadership by applying the chips in new IoT products in the Netherlands.


ARM Cortex M0/M3 DesignStart Pro Licensee

Partner for ARM Fast Models 
Programmer's view models enabling SW debug, analysis and optimization on a Virtual Platform throughout the design cycle prior to RTL or FPGA availability. The ARM Fast models are crucial within the Methods2Business SystemC-based design flow when developing IP targeting an ARM-based platform.



Certified Spinnaker partner of OneSpin-Solutions in Munich, Germany



Good collaboration with university of Novi Sad, Serbia, Ghent and Antwerp in Belgium, Eindhoven in the Netherlands and the Cadence Academic Network 






Partner news

June 6, 2016

Cadence and Adapt-IP publish whitepaper about the design and verification of the 802.11ah baseband for the Aegis-IP Wi-Fi HaLow IP solution. 
Using High-Level Synthesis to Design and Verify 802.11ah Baseband IP
By Farhad Mighani, Michael Sharp, and Mike McNamara, Adapt-IP and David Pursley, Cadence 

February 4, 2016

Imec and Holst Centre Present Wi-Fi HaLow Low-Power Fully Digital Polar Transmitter for IoT Applications at  IEEE International Solid-State Circuits Conference (ISSCC 2016)